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| Authors: | Christian Fabre, Iuliana Bacivarov, Ananda Basu, Martino Ruggiero, David Atienza, Eric Flamand |
| Group: | Computer Engineering |
| Type: | Inproceedings |
| Title: | PRO3D - Programming for Future 3D Manycore Architectures |
| Year: | 2012 |
| Month: | January |
| Pub-Key: | FBBRAF12 |
| Book Titel: | Proceedings of the 2012 Interconnection Network Architecture: On-Chip, Multi-Chip Workshop |
| Pages: | 47-50 |
| Publisher: | ACM |
| Abstract: | PRO3D tackles two 3D technologies and their consequences on stacked architectures and software stack: through silicon vias (TSV) and liquid cooling. 3D memory hierarchies and the thermal impact of software on the 3D stack are mainly explored. The PRO3D software development flow is based on a rigorous assembly of software components and monitors the thermal integrity of the 3D stack. PRO3D experiments are mainly targeted on P2012, an industrial embedded manycore platform. |
| Remarks: | http://doi.acm.org/10.1145/2107763.2107776 |
| Location: | Paris, France |
| Resources: | [BibTeX] [Paper as PDF] |
